Verfahren

 

Component placement


 

The placement of the components is made by SMD production lines with automatic optical alignment of the components. Wired components will be placed by machines if the volume and the complexity of the components allow for it. If not, such components will be placed manually.

Soldering is done by a reflow process, the wired components will be wave soldered, selectively soldered or manually soldered. Only lead free processes are used.


LAING INNOTECH GmbH & Co. KG
Theodor-Heuss-Str. 23 71566 Althütte Baden-Württemberg Deutschland


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Telefon      +49 (0)7146 9999 010

Fax             +49 (0)7146 9999 011